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Click on the links below to find out more about the key qualification.
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Program/Project Management
- Increased OEM revenue from zero to $12 million per year by directing startup of OEM services to HP. Successful Engineering planning and program management secured 50%+ of all HP recording head wafer business going forward. Simultaneously cut internal production costs by approximately 30%.
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- Established Program Management team to oversee schedule, negotiation, and contract issues related to OEM contracts, freeing up project engineers’ time and enabling expansion of capabilities to secure two new companies’ business.
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- Pioneered workstation clustering for IBM, positioning company as a viable alternative to competitors’ monopolizing of lab and university users.
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- Managed successful design, development, and release to manufacturing of seven recording-head products over five years, including internal and external (OEM) products.
New Product Development
- Designed key component in highest-selling system in company’s history, engineering and launching 9840 tape drive that generated $900 million revenue in first 18 months.
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- Led multifunctional team to deliver next-generation channel electronics chip that enabled industry’s most-advanced and highest-capacity storage system.
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- Cultivated and patented method of mass-producing dual-sensor thin-film heads with 90%+ yields.
- Spearheaded concept of programmable write current, allowing near 100% write-module yield in production.
- Developed recording head for first new IBM tape storage system in eight years, able to store more than 10 times the data on a cartridge as compared to the previous product.
Manufacturing Transfer
- Directed manufacturing transfer to offshore provider in China, and ensured presence of company Engineering personnel onsite until processes were seamless and production at full capacity. Outsourcing of products saved company $7.5 million annually with no lapse in quality.
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- Successfully transferred tape manufacturing function from Tucson to San Jose facility with a 97% track yield.
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Continuous Process Improvement / Six Sigma Management
- Boosted production from 50 to more than 400 units per week by identifying capacity barriers and establishing procedures to optimize yield.
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- Improved System Integration Yield (SIY) in first OEM product from 88% in first year to exceed 97% in second year, and gained an additional 10% in allocation with HP, generating $375,000 additional revenue.
- Instituted weekly cross-functional, engineering-yield meetings, rotating through all processes in a one-month cycle. Worked top five items impacting yield each week until all processes were at 95% yield or better.
- Innovated method of individual track gradation in head test as a compromise between drive performance and recording-head yield.
Cost/Budget Controls
- Redesigned a critical component to prevent damage caused by static discharge when using high-coercivity particle media, saving company $500,000 to $1 million per year in potential field replacement costs.
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- Patented a method for eliminating an extra magnetic ‘set’ step in the recording head mechanical build process by incorporating an additional pattern in the wafer process, saving approximately $30,000 in first year.
- Traveled to China to approve second offshore manufacturer for production in time for product general availability. Use of second supplier saved 10% on production costs over the first, and caused the first to lower costs as well, through shared sub-tier supplier pool.
Customer Relations Management
- Took company’s new technology directly to consumers in 12 national laboratories and six major universities, successfully illustrating its strengths to gain acceptance of the technology in the scientific/engineering community.
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- Created first class for IBM marketing representatives on the use of technical computing in physics applications.
- Collaborated with OEM customers to define technical schedule requirements in securing and successfully maintaining new OEM business.
Statistical Process Control (SPC)
- Identified and resolved performance problem originating in offshore supplier, and instituted new SPC procedures to ensure quality control throughout production process, safeguarding $6.5 million revenue stream.
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- Initiated project within engineering organization to standardize production data systems and formats to allow easier SPC tracking across variety of parameters and programs.
Resource Management
- Delivered 100% increase in program workload while design staff decreased by 30% during workforce reduction period.
- Launched matrix management system within design engineering function, allowing management of both programs and technical issues with same engineering personnel prior to eventual establishment of Program Management function.
- Optimized offshore coverage by training all engineers to cover multiple functions and utilizing rotation system to allow constant flow of fresh workers onsite.
Data Analysis
- Leveraged computer modeling expertise to identify cause of poor system integration yield with early dual-sensor heads.
- Tracked System Integration Yield performance during initial prototype tape-drive build at HP’s manufacturing facility in England; defined key specifications to ensure required process yields.
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